eWeek reports that IBM is making a push for 65-nm Chip Development.
According to eWeek, IBM has entered into an agreement with Infineon Technologies AG and Chartered Semiconductor Manufacturing in efforts to reach 65-nm and later, 45-nm chips on 300-mm silicon wafers (pictured here).
Almost 200 engineers will be conducting the work in IBM's Advanced Semiconductor Technology Center in Fishkill, NY.
IBM's PowerPC 970 (G5) is produced utilizing a 130-nm manufacturing process. 90nm process chips are expected from IBM at their new Fishkill plant. This size reduction is referred to as a "die shrink" and allows faster speeds, less heat, and increased manufacturing capacity. Unconfirmed rumors previously pegged 65nm process chips to arrive in 2005/2006 -- but this is of unknown reliability.
Last year, Apple launched CarPlay Ultra, the long-awaited next-generation version of its CarPlay software system for vehicles. Nearly a year later, CarPlay Ultra is still limited to Aston Martin's latest luxury vehicles, but that should change fairly soon.
In May 2025, Apple said many other vehicle brands planned to offer CarPlay Ultra, including Hyundai, Kia, and Genesis.
CarPlay Ultra...
Update: Since publication, new information has come to light suggesting the images have been AI-manipulated and are not in fact iPhone 18 Pro chassis parts. The original article follows.
The color options Apple is reportedly planning for the upcoming iPhone 18 Pro and iPhone 18 Pro Max have appeared online today in the form of images of chassis parts of unknown authenticity....
Siri is getting a major overhaul in iOS 27, but Apple also has some big updates planned for apps like Camera, Photos, and Wallet. There are multiple new AI features in the works, plus some non-AI upgrades.
Camera
Apple is moving Visual Intelligence from the Camera Control button to the Camera app in iOS 27, according to Bloomberg. There will be a Siri mode that will be available alongside...
