The Register delves a bit into some details of two new manufacturing techniques that IBM has developed.
The two new technologies ,'Strained Silicon Directly on Insulatar' (SSDOI) and Hybrid Orientation Technique (HOT), allow IBM to increase performance (by 40-65%) and decrease power requirements of future chips.
The techniques are being presented at the International Electron Devices Meeting in December of this year, and is expected to be commercially implemented in the next few years.
IBM manufactures the PowerPC 970 (G5) for Apple's PowerMac line as well as the G3 processor, currently used in the iBook.
During WWDC 2025, Apple revealed that macOS 26 Tahoe would be the final major macOS version for Intel-based Macs.
macOS 27 will be compatible with Apple silicon Macs only, meaning that you will need a Mac with an M-series chip or a MacBook Neo with an A18 Pro chip in order to install the software update. Apple will unveil macOS 27 during its WWDC 2026 keynote this Monday, June 8, and the...
On an earnings call in late April, Apple's CEO Tim Cook said that customer response to the MacBook Neo was "off the charts," and the popularity of the laptop has reportedly led the company to significantly boost production.
Apple supply chain analyst Ming-Chi Kuo this week said he believes that MacBook Neo shipments to Apple were doubled from an initial target of 5 million units to 10...
Update: Since publication, new information has come to light suggesting the images have been AI-manipulated and are not in fact iPhone 18 Pro chassis parts. The original article follows.
The color options Apple is reportedly planning for the upcoming iPhone 18 Pro and iPhone 18 Pro Max have appeared online today in the form of images of chassis parts of unknown authenticity....
